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Registration or login required. Registration or login required. MO-288-B Sep 2009 Item 11.11-821 Committee(s): JC-11, JC-11.11JEP95 Registrations Main Page Free download. Registration or login required. MO-247-D May 2007 Item 11.11-767Patent(s): AIT, ASAT: See Outline Committee(s): JC-11, JC-11.11JEP95 Registrations Main Page Free download. (U, X1, X2)F-PSON. This outline replaces all previous issues. MO-250-A Nov 2003 Committee(s): JC-11, JC-11.11JEP95 Registrations Main Page Free download. Registration or login required. Committee(s): JC-11, JC-11.11JEP95 Registrations Main Page Free download. 1 2 next last User login Username: * Password: * Create new account Request new password . Registration - Low Profile, Fine Pitch, Ball Grid Array (FBGA) Registration, 0.80 mm pitch (Square and Rectangle). Registration - Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Item 11.10-412 MO-232-A Aug 2001 Committee(s): JC-11, JC-11.10JEP95 Registrations Main Page Free download. LF-XBGA, LFR-XBGA. HVF-PQFP. Standards & Documents Search: no lead14 results Results Title Document # Date Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Dual Small Outline, No Lead Package. MO-208-C Nov 2001 Committee(s): JC-11.11JEP95 Registrations Main Page Free download.

MO-222-B.01 Dec 2010 Item 11.11-803, 11.11-842E Committee(s): JC-11JEP95 Registrations Main Page Free download. Registration or login required. Registration or login required. [ JEDEC China ] [ Forgot Password ] [ Site Login ] . Registration - Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). Registration or login required. Home About JEDECOverview Activities JEDEC HistoryPre-1960s 1960s 1970s 1980s 1990s 2000s 2010s Member List Board of Directors Committee Chairs Policies & Governance Patent Policy Year in Review: 2015 Other Organizations Contact Staff RSS Feeds Standards & DocumentsSearch Standards & Documents Technology Focus AreasFlash Memory: SSDs, UFS, e.MMC Mobile Memory: LPDDR, Wide I/O, Memory MCP Main Memory: DDR3 & DDR4 SDRAM 3D-ICs Memory Module Design File Registrations Lead-Free Manufacturing Registered Outlines: JEP95 Memory Configurations: JESD21-C ESD: Electrostatic Discharge Dictionary: JESD88Introduction Referenced Documents Registration Data Formats (RDFs) Type Registration, Data Sheets ID Codes Order Form ID Codes for Low Power Memories Order Form Copyright Information Patent Policy & Documents JEDEC Document Translation About JEDEC Standards CommitteesJC-10: Terms, Definitions, and Symbols JC-11: Mechanical Standardization JC-13: Government Liaison JC-14: Quality and Reliability of Solid State Products JC-15: Thermal Characterization Techniques for Semiconductor Packages JC-16: Interface Technology JC-40: Digital Logic JC-42: Solid State Memories JC-45: DRAM Modules JC-63: Multiple Chip Packages JC-64: Embedded Memory Storage and Removable Memory Cards NewsPress Releases JEDEC Awards Program: 2016 Honorees JEDEC Quality & Reliability Task Group in China Media Kit Events & MeetingsAll Events & Meetings Mobile & IOT Forum: Taiwan DDR4 Workshop: Presentations for Sale ROCS Workshop: Papers for Sale Join JEDECApply for Membership Membership Benefits Membership Dues & Details Members Area Order JEP 95 and JESD21-C Related Products Privacy Policy . Registration - Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. Registration or login required. Registration or login required. HE-PDFP-N. HP-VFQFP-N/HP-WFQFP-N. Registration - Scalable Quad Flat No-lead Packages, Square and Rectangular. HLF-PQFPN, HTF-PQFPN. Registration - High Profile Plastic Thermally Enhanced Enlarged Pitched Dual Flat No Lead Package. Registration - Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. d351235422

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